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TAIYO PSR-4000BN Series
LIQUID PHOTOIMAGEABLE SOLDER MASK Screen or Spray Application Available in Green or Dark Green Semi-Gloss Finish RoHS Compliant High Viscosity version for improved edge coverage on High Traces Compatible with Lead-Free Processing Best In Class for Small Hole Clearing Wide Processing Window Fine Dam Resolution Withstands ENIG & Immersion Tin
Revised March 2005
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PROCESSING PARAMETERS FOR PSR-4000BN SERIES
PSR-4000BN Series includes PSR-4000BN, PSR-4000BN (HV), and PSR-4000BN (DG). They are two-component, alkaline developable LPI solder mask products for flood screen and spray application methods. The products are designed to be user friendly with wide processing latitudes, low odor, fast developing and good resistance to alternate metal finishes such as ENIG and immersion Tin while maintaining dams of 3 mils or less. The PSR-4000 BN (HV) provides improved edge coverage over high circuits while the PSR4000BN (DG) provides the same benefit in a Dark Green color. PSR-4000BN Series meets or exceeds the requirements of IPC SM-840C Class H and Class T, Bellcore GR78-CORE Issue 1, and has a UL flammability rating of 94V-0. All Taiyo America products comply with the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the use of certain Hazardous Substances (RoHS) in electrical and electronic equipment. PSR-4000BN SERIES COMPONENTS PSR-4000BN Series/ CA-40BN Mixing Ratio 100 parts 43 parts Color Green White Mixed Properties BN HV DG Solids 77% 77% 77% Viscosity 135-165ps 175-225ps 175-225ps Specific Gravity 1.39 1.39 1.39
MIXING
PSR-4000BN Series is supplied in pre-measured containers with a mix ratio by weight of 100 parts PSR-4000BN and 43 parts CA40BN. PSR-4000BN can be mixed by hand with a mixing spatula for 10 - 15 minutes. Mixing can be done with a mechanical mixer at low speeds to minimize shear thinning for 10 - 15 minutes. Also, mixing can be done with a paint shaker for 10 - 15 minutes.
PRE-CLEANING
Prior to solder mask application, the printed circuit board surface needs to be cleaned. Various cleaning methods include Pumice, Aluminum Oxide, Mechanical Brush, and Chemical Clean. All of these methods will provide a clean surface for the application of PSR-4000BN Series. Hold time after cleaning the printed circuit board should be held to a minimum to reduce the oxidation of the copper surfaces.
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PROCESSING PARAMETERS FOR PSR-4000BN SERIES
SCREEN PRINTING Method: Single Sided and Double Sided Screening * Screen Mesh: 74 - 110 * Screen Mesh Angle: 22.5 Bias * Screen Tension: 20 - 28 Newtons * Squeegee: 60 - 80 durometer * Squeegee Angle: 27 - 35 * Printing Mode: Flood / Print / Print * Flood Pressure: 20 - 30 psi * Printing Speed: 2.0 - 9.9 inches/sec * Printing Pressure: 60 - 100 psi
TACK DRY CYCLE
The Tack Dry step is required to remove solvent from the solder mask film and produce a firm dry surface. The optimum dwell time and oven temperature will depend on oven type, oven loading, air circulation, exhaust rate, and ramp times. Excessive tack dry times and temperature will result in difficulty developing solder mask from through holes and a reduction in photo speed. Insufficient tack dry will result in artwork marking and/or sticking. Typical tack dry conditions for PSR-4000BN Series are as followed: * * * * Oven Temperature: 150 - 185F (65 - 85C) For Single-Sided (Batch Oven) 1st Side: Dwell Time: 10 - 20 minutes 2nd Side: Dwell Time: 25 - 45 minutes For Double-Sided (Conveyorized or Batch Oven) Dwell Time: 25 - 60 minutes
EXPOSURE
PSR-4000BN Series requires UV exposure to define solder mask dams and features. The spectral sensitivity of PSR-4000BN Series is in the area of 365 nm. Exposure times will vary by bulb type and age of the bulb. Below are guidelines for exposing PSR-4000BN Series. * * * Exposure Unit: 5 kW or higher Stouffer Step 21: Clear 8 minimum (on metal / under phototool) Energy: 250 mJ / cm2 minimum (under phototool)
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PROCESSING PARAMETERS FOR PSR-4000BN SERIES
DEVELOPMENT PSR-4000BN Series is developed in an aqueous sodium or potassium carbonate solution. Developing can be done in either a horizontal or vertical machine. * * * * * * Solution: 1% by wt. Sodium Carbonate or 1.2% Potassium Carbonate pH: 10.6 or greater Temperature: 85 - 105F (29 - 41C) Spray Pressure: 25 - 45 psi Dwell Time in developing chamber: 45 - 90 seconds Water rinse is needed to remove developer solution followed by a drying step
FINAL CURE PSR-4000BN needs to be thermally cured to insure optimal final property performance. Thermal curing can be done in a batch oven or conveyorized oven. * * Temperature: 275 - 300F (135 - 149C) Time at Temperature: 45 - 60 minutes
For Process Optimization please contact your local Taiyo America Representative
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FINAL PROPERTIES FOR PSR-4000BN
IPC-SM-840C, Class H & T, Solder Mask Vendor Testing Requirements
TEST Visual Curing Non-Nutrient Dimensional Pencil Hardness Adhesion Machinability Resistance to Solvents and Cleaning Agents Hydrolytic Stability and Aging Solderability Resistance to Solder Dielectric Strength Thermal Shock SM-840 PARAGRAPH 3.4.8 3.4.5 3.4.6 3.4.10 3.5.1 3.5.2 3.5.3 3.6.1.1 3.6.2 3.7.1 3.7.2 3.8.1 3.9.3 REQUIREMENT Uniform in Appearance Ref: 3.6.1.1, 3.7.1 and 3.7.2 Does not contribute to biological growth No Solder Pickup and Withstand 500 VDC Minimum "F" Rigid - Cu, Ni, FR-4 No Cracking or Tearing Table 3 Solvents No Change after 28 days of 95-99C and 90-98% RH No Adverse Effect J-STD-003 No Solder Sticking 500 VDC / mil Minimum No Blistering, Crazing or De-lamination RESULT Pass Pass Pass Pass Pass - 8H Pass Pass Pass Pass Pass Pass 2800 VDC/mil Pass
Specific Class "H" Requirements
TEST SM-840 PARAGRAPH REQUIREMENT RESULT Pass - File #E166421 UL Name: PSR-4000BN / CA-40BN PSR-4000BN (HV) / CA-40BN PSR-4000BN (DG) / CA-40BN Pass (1.29 x 1013 ohms) Pass (3.31 x 1013 ohms) Pass (6.61 x 1010 ohms) Pass (2.50 x 1012 ohms) Pass (1.89 x 1010 ohms) Pass (1.07 x 1013 ohms) Pass (1.35 x 1012 ohms)
Flammability
3.6.3
UL 94V-0
Insulation Resistance Before Soldering After Soldering Moisture & Insulation Resistance Before Soldering-In Chamber Before Soldering-Out of Chamber After Soldering-In Chamber After Soldering-Out of Chamber Electrochemical Migration
3.8.2
5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum >2.0 x 106 ohms, no dendritic growth
3.9.1
3.9.2
Specific Class "T" Requirements
TEST Flammability Insulation Resistance Before Soldering After Soldering SM-840 PARAGRAPH 3.6.3 3.8.2 REQUIREMENT Bellcore 02 Index - 28 minimum 5 x 108 ohms minimum 5 x 108 ohms minimum RESULT Pass - 74 Pass (2.23 x 109 ohms) Pass (1.14 x 1013 ohms)
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FINAL PROPERTIES FOR PSR-4000BN
Specific Class "T" Requirements
TEST Moisture & Insulation Resistance Before Soldering-In Chamber Before Soldering-Out of Chamber After Soldering-In Chamber After Soldering-Out of Chamber Electrochemical Migration 3.9.2 SM-840 PARAGRAPH 3.9.1 REQUIREMENT 5 x 108 ohms minimum 5 x 108 ohms minimum RESULT
Pass (1.77 x 109 ohms) Pass (1.80 x 1013ohms) 8 5 x 10 ohms minimum Pass (2.78 x 1010ohms) 8 5 x 10 ohms minimum Pass (2.31 x 1013ohms) < 1 decade drop, no dendritic growth Pass REQUIREMENT Internal Test at 1 MHz Internal Test at 1 MHz Internal Test (1/2) TML 1% CVCM 0.10% Nickel(85C/30 min)Tape Test Adhesion No attack - 24 hours No attack - 24 hours No attack - 24 hours No attack - 24 hours No attack - 30 Minutes No attack - 30 Minutes No attack - 30 Minutes No attack - 15 Minutes No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) Crosscut (10/10) after tape Crosscut (10/10) after tape Crosscut (10/10) after tape Adhesion of Glue Dot to PSR-4000BN RESULT 4.5 0.0290 70 / 140 ppm TML-0.51% CVCM-0.02% Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass 100/100 100/100 100/100 Excellent
Additional Tests / Results
TEST Dielectric Constant Dissipation Factor CTE Outgassing Test ASTM E-595-90 A 2 J/cm2 UV Cure was done after thermal cure. Electroless Nickel / Immersion Gold Resistance Solvent Resistance Acetone: MEK: IPA: PMA: Acid Resistance HCI - 10%: H2SO4 - 10%: Base Resistance NaOH - 10%: Boiling Water Resistance: Solder / Flux Resistance (Alphametals) Alpha 857 water soluble: NR060 no-clean: 3355-NB rosin-based: NR-3000A4 no-clean: Solder/Flux Resistance(Multicore) X32-10M no-clean: X32-06I no-clean: Solder/Flux Resistance-(Sanwa) SR-270 rosinbased: Conformal Coating Adhesion: Humiseal 1 B31 acrylic: Humiseal 1A20 urethane: Dow Corning 3-1753 silicone: Glue Dot Adhesion - Loctite 3609
Taiyo America, Inc. (TAIYO) warrants its products to be free from defects in materials and workmanship for the specified warranty period (PSR-4000BN / CA-40BN Warranty period is 12 Months) provided the customer has, at all times, stored the ink at a temperature of 68oF or less. TAIYO accepts no responsibility or liability for damages, whether direct, indirect, or consequential, resulting from failure in the performance of its products. If a TAIYO product is found to be defective in material or workmanship, its liability is limited to the purchase price of the product found to be defective. TAIYO MAKES NO OTHER WARRANTY, EXPRESS OR IMPLIED, AND MAKES NO WARRANTY OF MERCHANTABILITY OR OF FITNESS FOR ANY PARTICULAR PURPOSE. TAIYO'S obligation under this warranty shall not include any transportation charges or costs of installation or any liability for direct, indirect, or consequential damages or delay. If requested by TAIYO, products for which a warranty claim is made are to be returned transportation prepaid to TAIYO'S factory. Any improper use or any alteration of TAIYO'S product by the customer, as in TAIYO'S judgment affects the product materially and adversely, shall void this limited warranty.

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